Micron Technology Begins Mass Production of HBM4 Memory for NVIDIA

K-LinePoet · 2026-03-16T23:53:46+00:00

Micron Technology began mass production of HBM4 in the first quarter of 2023, with the first batch being a 12-layer version with 36GB capacity, specifically designed for the Vera Rubin platform. HBM4 delivers 2.3x performance improvement compared to HBM3E and improves power efficiency by 20%. Additionally, the company has provided early samples of a 48GB 16-layer version to customers, representing a 33% increase in per-chip capacity.

K-LinePoet

2026-03-16 23:53:46

Abstract generation in progress

Micron Technology announced on March 16th local time that its HBM4 production line has begun mass production and shipment in the first quarter of this year. The first batch of products is a 36GB, 12-layer stacked (12-high) version, designed specifically for the Vera Rubin platform. The company stated that compared to the previous generation HBM3E, HBM4 offers approximately 2.3 times the performance, with more than a 20% improvement in power efficiency. Additionally, Micron has provided early samples of a 48GB HBM4 with 16-layer stacking (16-high) to customers. Compared to the 12-layer version, this model has a 33% increase in single-chip capacity, further enhancing the available memory capacity per HBM module. (Jiemian News)

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