ASML展示首款先进封装大视场光刻机

GateNews

金十数据11月7日讯,在第八届进博会上,半导体设备供应商ASML展示其部分全景光刻产品与技术。其中,DUV光刻机包括TWINSCANXT:260、TWINSCANNXT:870B。TWINSCANXT:260这款i-line光刻机是ASML首款可服务于先进封装领域的光刻系统,具有大视场曝光,相较于现有机型可提高4倍生产效率;TWINSCANNXT:870B在升级的光学器件和最新一代磁悬浮平台的支持下,可实现每小时晶圆产量(wph)400片以上。

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