Gate News message, April 21 — The 0G Foundation has partnered with Alibaba Cloud to integrate the Qwen large language model series on-chain. Through a tokenized mechanism, developers can embed direct Qwen access into their

Institutional-scale stablecoins require a mature compliance and risk-management settlement layer; banks must trust blockchain to handle legal custody and compliance, with OSL pursuing licensed, AI-enhanced control layers for efficient settlement. Abstract: Eugene Cheung at Money 20/20 Asia argues that scaling stablecoin payments to institutional levels hinges on a licensed, AI-enhanced control layer and a mature compliance and risk-management settlement layer to ensure effective handling of legal, custody, and settlement risks. This underpins OSL’s strategy for institution-grade infrastructure and aims to build an operationally robust system that can meet complex regulatory requirements.

Gate News message, April 21 — Qualcomm CEO Cristiano Amon recently met with executives from Samsung Electronics, SK Hynix, and LG Electronics to discuss memory supply, chip manufacturing, and AI partnerships. The talks centered on addressing Qualcomm's tight LPDDR memory supply as demand for AI

South Korea's Naver and India's TCS have partnered to develop AI and cloud services in India, focusing on banking, manufacturing, and retail. This collaboration enhances Naver's market entry while TCS boasts significant AI revenue.

Revolut's CEO Nik Storonsky stated that the digital bank will not pursue an IPO before 2028, emphasizing the potential of future secondary share sales for building trust. After obtaining a UK banking license, they are applying for a US bank charter, expecting approval within a year.

Kaio, a tokenization firm in Abu Dhabi, raised $8 million from Tether and other investors to enhance blockchain asset distribution. With a total of $19 million, it manages around $100 million and plans to launch an on-chain fund with Mubadala Capital.

Nvidia CEO Jensen Huang criticized U.S. chip export restrictions, arguing they won't hinder China's AI advancements. He stressed the need for a unified global tech ecosystem and emphasized Nvidia's growing market share despite competition, highlighting the challenges in disrupting computing ecosystems.

India has begun construction on its first advanced 3D chip packaging facility in Odisha, with an investment of 19.4 billion rupees. Backed by Intel and Lockheed Martin, it aims for commercial production by August 2028, focusing on advanced packaging technologies to enhance electrical performance for AI and 5G applications.

Ukrainian President Zelenskyy urged Europe to enhance its defense autonomy by creating a unified air defense system within a year, revealing ongoing discussions with key European leaders.

Huawei has partnered with Vietnam's SHB to enhance banking technology through its Digital CORE Solution and database services, addressing mobile security regulations and expanding Huawei's influence in Vietnam's financial sector.