Infineon and UMC Sign Memorandum of Understanding

On March 12, according to Infineon’s official Weibo, Infineon Technologies AG (referred to as “Infineon”) and United Microelectronics Corporation (referred to as “UMC”) recently announced the signing of a Memorandum of Understanding (MOU) aimed at collaboratively promoting supply chain emissions reduction, thereby further advancing sustainable supply chain development.

Specifically, Infineon has committed to the SBTi to reduce absolute greenhouse gas emissions in Scope 1 and Scope 2 by 72.5% compared to the baseline year 2019 by 2030, aligning with the goal of limiting global temperature rise to within 1.5°C. The Scope 1 and Scope 2 targets pertain to the company’s own operational emissions. Additionally, Infineon has set Scope 3 emission reduction targets and pledged that by 2029, 72.5% of its suppliers will establish science-based carbon reduction targets related to procurement of goods and services, capital goods, and upstream transportation and distribution, addressing most of its carbon footprint.

UMC became the first wafer foundry globally to obtain SBTi approval in 2022, and by 2025, it will adjust its carbon reduction targets to meet the SBTi standards for keeping global warming within 1.5°C. Using 2020 as the baseline year, UMC aims to reduce Scope 1 and Scope 2 emissions by 42% and Scope 3 emissions by 25% before 2030, with the goal of achieving net-zero greenhouse gas emissions by 2050.

Given that Scope 3 emissions typically account for the largest proportion of a company’s total emissions, both parties believe that only through joint collaboration can carbon dioxide reduction be most effectively achieved. This is especially important in the semiconductor industry, where supply chain levels are diverse and structurally complex.